International conference on light weight plastic tubs, trays, jars, containers and cups for food packaging
23-24 May 2017, Westin Chicago North Shore, Chicago, IL
The 6th AMI international conference on thin wall packaging will take place on May 23-24, 2017 at The Westin Chicago North Shore in Chicago, IL, USA. Located in the heart of the packaging industry, attendees will participate in second-to-none networking and experience a compelling conference program.
Thin Wall Packaging 2017 will offer a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in lightweight plastics packaging. In conjunction with the conference, Intertek will host a food packaging safety and regulatory compliance seminar on May 25th.
ITP will display samples of its skin films and of thermal lamination at booth no.30.